.Buildings.HeatTransfer.Data.SolidsPCM

Information

Package with records for solid materials with embedded phase change material. The material is characterized by its thermal conductivity, mass density and specific heat capacity, as well as the solidus and liquidus temperatures, and the latent heat.

For a description of the parameter nStaRef, which is used to generate the spatial grid, see the documentation of the package Buildings.HeatTransfer.Data.Solids.

Contents

Name	Description
Generic	Thermal properties of solids with heat storage
PCM020	Wallboard with 20% of microencapsulated paraffin
PCM030	Wallboard with 30% of microencapsulated paraffin
MicronalSmartBoard23	Micronal PCM SmartBoard 23
MicronalSmartBoard26	Micronal PCM SmartBoard 26

Revisions

• February 20, 2013, by Michael Wetter:
  First implementation.